7Semi LGA16 QFN16 0.5mm Breakout Adapter PCB

The 7Semi LGA16 / QFN16 0.5mm Breakout Adapter PCB is a precision-engineered adapter board that allows easy prototyping and testing of small-pitch SMD components in LGA16 or QFN16 packages. It converts the fine 0.5 mm pitch SMD layout into a standard 2.54 mm DIP format, enabling the use of these compact ICs on breadboards, perfboards, and through-hole circuits. The adapter provides clearly labeled pinouts, gold-plated pads, and durable FR-4 construction, making it an essential tool for engineers, students, and hobbyists working with miniature surface-mount ICs.

Technical Specifications:

• Supported Packages: LGA16 and QFN16
  
• Pin Count: 16 pins
  
• SMD Pad Pitch: 0.5 mm
  
• DIP Pin Pitch: 2.54 mm (standard breadboard spacing)
  
• Board Type: Double-sided adapter PCB
  
• Material: High-quality FR-4 PCB substrate
  
• Finish: Gold-plated or tin-plated pads for superior solderability
  
• Dimensions: Compact, breadboard-friendly design
  
• Color: Green solder mask with clear white silkscreen pin labeling
  
• Operating Temperature: -40°C to +85°C
  
• Mounting Type: SMD on top, DIP through-hole pins on bottom

Features:

• Converts fine-pitch LGA16 or QFN16 packages to DIP format
• 0.5 mm pad pitch for precise alignment and soldering
  
• Standard 2.54 mm DIP pin spacing for breadboard compatibility
  
• Gold/tin-plated pads for better conductivity and durability
  
• High-quality FR-4 board ensures stability and long life
  
• Clear silkscreen labeling for easy pin identification
  
• Double-sided design for flexible mounting options
  
• Ideal for manual soldering, testing, and circuit prototyping

Applications:

• Prototyping and testing of LGA and QFN ICs
  
• Converting small-pitch SMD components for breadboard use
  
• Educational and research projects in electronics
  
• Debugging and evaluation of new IC designs
  
• Circuit design and development in R&D environments
  
• Repair or modification of electronic assemblies
  
• DIY electronics and maker projects involving compact IC packages